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Product Information
Technical Datasheet
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Description :

Is a novel low modulas expansion joint sealant and adhesive , especially formulated to ensure bubble free cure even at very high temperature and humidity climatic conditions . The product displays escellent thixotropy allowing its use even in very large voids.

Features & Benefits :

It cures by reaction with atmospheric humidity to produce a joint sealant with 50% joint movement accomodation factor and excellent adhesion on substrates traditionally problematic for PU sealants ,eg glass , aluminium , steel , polycarbonate etc . The extrusion rate and tooling of the sealant remain the same throughout a very wide range of temperature and humidity conditions .