Description

SikaBond® MS Wood Floor Gun Grade is a high quality, gun-applied MS adhesive for bonding wooden floors to all common substrates. Being permanently elastic it accommodates differential movement caused by changes in humidity and climatic conditions.

When used as part of the Sika® AcouBond® system, it is ideal for use with underfloor heating systems.

Uses

Bonds directly to all common subfloor materials:

• Concrete
• Anhydrite
• Chipboard
• Plywood
• Metal
• Ceramic tiles
• Most natural stone floors.

Benefits

• Water free – will not cause warpage or curl of wood blocks/planks.
• Permanently flexible – compensates for subfloor movement.
• Suitable for use with underfloor heating (due to high flexibility).
• Odourless.
• Excellent gap filling properties for uneven surfaces.
• Bonds to all common subfloor materials